Get Instant Quote for Part Number BCM 23C64D 8168 with NSN 5962-01-260-3008 by Allegro Microsystems Inc
| Part Number : BCM 23C64D 8168 | Manufacturer: Allegro Microsystems Inc | NSN : 5962-01-260-3008 |
| NIIN : 012603008 | Alternate P/N : BCM23C64D8168 | Item Name : microcircuit memory |
| CAGE Code : 31019 | FSC : 5962 Microcircuits Electronic | |
Part number BCM 23C64D 8168 with NSN 5962012603008, having item name Microcircuit Memory, under FSC 5962 Microcircuits Electronic is available and ready for shipping. Sourced from Allegro Microsystems Inc, you can easily order BCM 23C64D 8168 with CAGE Code 31019 at a competitive price. To get a quick quote for this part, fill out the form.
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NSN Information for Part Number BCM 23C64D 8168 with NSN 5962-01-260-3008, 5962012603008NSN FSC NIIN CLS Hazmat DEMIL Cancelled NSN 5962-01-260-3008
Item Description:Microcircuit Memory
5962 012603008 0 N B CIIC HCC ESD PMIC Criticality ENAC U B A 0 Part Number ISC RNVC RNCC HCC MSDS SADC BCM 23C64D 8168 5 1 5
Characteristics Data of NSN 5962-01-260-3008, 5962012603008
MRC Criteria Characteristic ADAQ BODY LENGTH 1.290 INCHES MAXIMUM ADAT BODY WIDTH 0.595 INCHES NOMINAL ADAU BODY HEIGHT 0.165 INCHES MAXIMUM AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+125.0 DEG CELSIUS AGAV END ITEM IDENTIFICATION 5895-01-146-6736 DIGITAL COMMUNI CBBL FEATURES PROVIDED ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND 3-STATE OUTPUT CQSJ INCLOSURE MATERIAL CERAMIC CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CQWX OUTPUT LOGIC FORM COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC CQZP INPUT CIRCUIT PATTERN 14 INPUT CWSG TERMINAL SURFACE TREATMENT SOLDER CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 7.0 VOLTS MAXIMUM POWER SOURCE CZEQ TIME RATING PER CHACTERISTIC 325.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 325.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT CZER MEMORY DEVICE TYPE ROM CZZZ MEMORY CAPACITY UNKNOWN TEST TEST DATA DOCUMENT 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). TTQY TERMINAL TYPE AND QUANTITY 24 PRINTED CIRCUIT
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-260-3008 Item Description: Microcircuit Memory | 5962 | 012603008 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| BCM 23C64D 8168 | 5 | 1 | 5 |
Characteristics Data of NSN 5962-01-260-3008, 5962012603008
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 1.290 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.595 INCHES NOMINAL |
| ADAU | BODY HEIGHT | 0.165 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+125.0 DEG CELSIUS |
| AGAV | END ITEM IDENTIFICATION | 5895-01-146-6736 DIGITAL COMMUNI |
| CBBL | FEATURES PROVIDED | ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND 3-STATE OUTPUT |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 14 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 325.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 325.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | ROM |
| CZZZ | MEMORY CAPACITY | UNKNOWN |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
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